This funding is an important component of the American Chip and Science Act.
Authorities are examining the aid arrangement, although information concerning prospective renegotiations are unclear.
Foxconn is looking for around $72 million, while Dixon Technologies is looking for around $12 million.
The plan includes the first high-volume production of 300mm wafers for advanced semiconductors.
The China Semiconductor Market Organization (CSIA) sustains the examination and slams united state plans as unjust.
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